TechDebt 2022
co-located with ICSE 2022

Tools play a critical role in understanding the management, monitoring, and measurement of technical debt in real-world situations. We invite researchers, practitioners, and organizations to showcase new techniques, methods, and tools that can aid practitioners and decision-makers in these critical tasks to participate in TechDebt 2022. Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.

While other software engineering disciplines—such as software maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

Call For Tool Papers

Tools play a critical role in understanding the management, monitoring, and measurement of technical debt in real-world situations. We invite researchers, practitioners, and organizations to showcase new techniques, methods, and tools that can aid practitioners and decision-makers in these critical tasks to participate in TechDebt 2022. Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.

While other software engineering disciplines—such as software maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

Submission types

Tools track accepts two types of submissions:

  • Tool presentation papers (up to 5 pages): describe innovative and original tools addressing technical debt issues or aiming at the management of technical debt. Submitted tool papers will be peer-reviewed and accepted submissions will be published in the conference proceedings.
  • Extended abstract (1-2 pages): describe innovative and original initial tools idea for which there is not yet a prototype in order to obtain early feedback. Extended abstracts provide practitioners with an opportunity to showcase a tool-specific perspective. Extended abstracts are not peer-reviewed and will not be published in the conference proceedings.

Suggested content for both types of submissions, the program committee, and chairs will look for: - The alignment to the overarching technical debt theme of the conference. - How the purpose of the tool is addressed and how validation experiences with practitioners have been planned or conducted (if applicable)

Submission process

In HotCRP, on top of specifying the type of submission, indicate how you will participate in the conference session (you may select one or both):

  • Panel participant: In the panel discussion we will engage participants and the audience on how the showcased tools help address technical debt challenges.
  • Tool demonstration: If you propose to showcase your tool or product from your organization, please let us know your requirements *(such as space, equipment, …). A dedicated demo session will be part of the Tools track.

All accepted papers will also have the possibility to bring a poster during the conference. Papers and extended abstracts must be submitted electronically via the TechDebtConf2022 HotCRP site (https://techdebt22.hotcrp.com/). Select the correct track and paper type on the submission form.

Submissions must be in PDF and conform to the ACM formatting guidelines applied for ICSE 2022. Submissions may not exceed the number of pages specified above (including all text, references, and figures). Purchases of additional pages in the proceedings are not allowed.

Formatting instructions are available at https://www.acm.org/publications/proceedings-template for both LaTeX and Word users.

The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of ICSE 2022. The official publication date affects the deadline for any patent filings related to published work. Accepted papers must be presented in person at the conference by one of the authors. Accepted submissions will be published as part of the ICSE co-located events proceedings.

Extended Abstracts

Questions? Use the TechDebt Tools Track contact form.