Industry TrackHPCA 2027

Submission Instructions

At its best, computer architecture is a dialogue between science and engineering—informed by the possibility of transformative new applications and architectures, and grounded in practical implementation and deployment. This track aims to educate the wider computer architecture community on the challenges facing industry and to encourage investigation of potential solutions. The session will include a small number of papers selected based on depth and relevance to the HPCA audience.

Architects, designers, and developers involved in industrial computer system design and development are invited to submit papers centered on industrial products or processes across their lifecycle, including deployed, planned, or canceled products, as well as new challenges, issues, and opportunities in next-generation computer systems. Submitted papers must provide insights and results that are unique to industry and clearly distinguishable from papers appropriate for the regular track.

Authors should submit an abstract by July 24, 2026, and the full paper by July 31, 2026. No extensions will be granted. Submissions must be in PDF format and follow the HPCA formatting guidelines (11 pages excluding references), available on the submission website.

Paper Registration/Submission Site: Upload Abstracts and Papers to HotCRP

HPCA Industry Track Guidelines

The goal of the HPCA Industry Track is to publish papers written by industry authors with content directly related to an industrial product or process. Appropriate submissions include papers that describe, characterize, or evaluate industrial products or their components, and that provide insights into real-world industry challenges, design tradeoffs, and lessons learned. This includes:

• Retrospective evaluations of real, working products,

• Descriptions or evaluations of upcoming products on industry roadmaps, and

• Planned products that were ultimately canceled, provided they yield meaningful insights or lessons learned.

The following submissions will not be considered for the Industry Track:

• Short-term student internship projects conducted in industry, and

• Speculative papers about hardware or systems that are not tied to a concrete industrial product or process.

Such submissions are more appropriate for the regular (main) track.

Papers must have the first author and the majority of authors working in industry. Papers may include co-authors from academia, provided that the content is clearly related to an industrial product or process. Authors with dual academic–industry affiliations may count as industry authors if their industry role involves substantive contribution to an industrial product or process. However, temporary roles such as internships or visiting student appointments do not count toward the industry-author requirement.

All author affiliations must be fully and accurately disclosed in the HotCRP submission form. Author names must not appear in the submitted PDF. Failure to disclose an academic affiliation (including dual affiliations) will result in desk rejection.

Submissions must follow standard double-blind reviewing rules with respect to author identities. The company and product being evaluated need not be anonymized, as this information is necessary to assess industrial relevance and credibility. Review assignments will continue to follow standard conflict-of-interest practices.

Research papers whose scope is not clearly tied to an industrial product or process are not appropriate for the Industry Track and will be rejected from the track, even if all authors are from industry. Such papers should be submitted to the regular track.

Papers submitted to the Industry Track will be evaluated using the same standards of quality as papers submitted to the regular track.

Topics of Interest

Topics of interest include, but are not limited to:

• Processors, SoCs, GPUs, and domain-specific architectures and accelerators, including microarchitectural innovations and domain adaptations

• Architectures for HPC, cloud, and data-center systems, including systems-level and deployment considerations

• Applications of generative AI for HPC and data-center workloads, as well as architectures supporting emerging AI workloads

• Algorithm, IP, and hardware/software co-design and co-optimization

• Processor, cache, memory, and storage architectures, including emerging memory technologies

• Parallel, multi-core, heterogeneous, FPGA, and reconfigurable architectures

• Embedded, mobile, and IoT processors and systems

• Interconnect, network interface, and high-performance I/O architectures

• Power-efficient, dependable, and secure architectures, including analysis and exploitation of product security vulnerabilities

• Innovative hardware/software tradeoffs, including the impact of compilers and system software on architecture

• Performance, power, and energy modeling, characterization, and evaluation

• Architectures using emerging technologies, and architectures for emerging applications such as bioinformatics

• Architectures and systems enabling the commercialization of quantum computing