Tool Track
Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues. Tools play a critical role in understanding the management, monitoring, and measurement of technical debt in real-world situations. We invite researchers, practitioners, and organizations to showcase new techniques, methods, and tools that can aid practitioners and decision-makers in these critical tasks to participate in TechDebt 2027.
While other software engineering disciplines-such as software maintenance and evolution, refactoring, software quality, and empirical software engineering-have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.
Submission types
Tool presentation papers (up to 5 pages + 2 pages for references): describe innovative and original tools addressing technical debt issues or aiming at the management of technical debt. Submitted tool papers will be peer-reviewed and accepted submissions will be published in the conference proceedings.
The program committee and chairs will look for:
- The alignment to the overarching technical debt theme of the conference.
- How the purpose of the tool is addressed and how validation experiences with practitioners have been planned or conducted (if applicable)
Submission process
TechDebt 2027 uses a doubly anonymous reviewing model for the Technical Track. Therefore, all submissions to this track have to fulfill the doubly-anonymous reviewing requirements (refer to the ICSE Q&A for more details). Any submission that does not comply with these requirements may be desk-rejected without further review.
Papers must be submitted electronically via the TechDebt 2027 HotCRP site.
Submission site: https://techdebt2027-tool.hotcrp.com.
Submissions must conform to the IEEE conference proceedings template, specified in the IEEE Conference Proceedings Formatting Guidelines (title in 24pt font and full text in 10pt type, LaTeX users must use \documentclass[10pt,conference]{IEEEtran} without including the compsoc or compsocconf options).
Link: https://www.ieee.org/conferences/publishing/templates.html
Important dates
- January 31, 2027: Submission deadline
- February 24, 2027: Notification of acceptance or rejection
- March 22, 2027: Camera-ready papers
Further inquiries
All inquiries may be directed to track chair:
Nikolaos Tsantalis: nikolaos.tsantalis@concordia.ca