Sun 14 Apr 2019 10:00 - 10:25 at Garden Room - Session1

Trusted Execution Environments (TEE) are widely deployed, especially on smartphones. A recent trend in TEE development is the transition from vendor-controlled, single-purpose TEEs to open TEEs that host Trusted Applications (TAs) from multiple sources with independent tasks. This transition is expected to create a TA ecosystem needed for providing stronger and customized security to apps and OS running in the Rich Execution Environment (REE). However, the transition also poses two security challenges: enlarged attack surface resulted from the increased complexity of TAs and TEEs; the lack of trust (or isolation) among TAs and the TEE.

In this paper, we first present a comprehensive analysis on the recent CVEs related to TEE and the need of multiple TEE scheme. We then propose TEEv, a TEE virtualization architecture that supports multiple isolated, restricted TEE instances (i.e., vTEEs) running concurrently. Relying on a tiny hypervisor (we call it TEE-visor), TEEv allows TEE instances from different vendors to run in isolation on the same smartphone and to host their own TAs. Therefore, a compromised vTEE cannot affect its peers or REE; TAs no longer have to run in untrusted/unsuitable TEEs. We have implemented TEEv on a development board and a real smartphone, which runs multiple commercial TEE instances from different vendors with very small porting effort. Our evaluation results show that TEEv can isolate vTEEs and defend all known attacks on TEE with only mild performance overhead.

Sun 14 Apr
Times are displayed in time zone: (GMT-04:00) Eastern Time (US & Canada) change

10:00 - 12:05: Research Papers - Session1 at Garden Room
vee-2019-papers10:00 - 10:25
Wenhao LiShanghai Jiao Tong University, China, Yubin XiaShanghai Jiao Tong University, China, Long LuNortheastern University, n.n., Haibo ChenShanghai Jiao Tong University, China, Binyu ZangShanghai Jiao Tong University, China
vee-2019-papers10:25 - 10:50
Ethan JohnsonUniversity of Rochester, USA, Komail DharseeUniversity of Rochester, USA, John CriswellUniversity of Rochester, USA
vee-2019-papers10:50 - 11:15
Hao Li , Xuefei XuIntel, China, Jinkui RenIntel, China, Yaozu DongIntel, China
vee-2019-papers11:15 - 11:40
Spoorti DoddamaniBinghamton University, USA, Piush Kumar SinhaBinghamton University, USA, Hui LuBinghamton University, USA, Tsu-Hsiang K. ChengBinghamton University, USA, Hardik H. BagdiBinghamton University, USA, Kartik GopalanBinghamton University, USA
vee-2019-papers11:40 - 12:05
Pierre OlivierVirginia Tech, USA, Daniel ChibaVirginia Tech, USA, Stefan LankesRWTH Aachen University, Germany, Changwoo MinVirginia Tech, USA, Binoy RavindranVirginia Tech, USA