Wing Lam - ECOOP and ISSTA 2023

Mon 17 - Fri 21 July 2023 Seattle (University of Washington campus), Washington, United States

Registered user since Mon 25 Apr 2016

Name:Wing Lam

Country:United States

Affiliation:University of Illinois at Urbana-Champaign

Personal website: http://winglam2.web.engr.illinois.edu/

Contributions

2023

ECOOP/ISSTA

Harnessing Large Language Models for Simulink Toolchain Testing and Developing Diverse Open-Source Corpora of Simulink

ISSTA

Session Chair of ISSTA 10: Test Optimizations (part of Technical Papers)

Show activities from other conferences

ECOOP and ISSTA 2023-profile
View general profile