Call for Contributions
The International Conference on Technical Debt (TechDebt) is the premier venue for researchers and practitioners to discuss approaches for managing various types of Technical Debt, to share experiences and best practices. TechDebt’s Industry Track fosters a deep exchange between academia, industry and non-commercial organizations by inviting practitioners to share their experiences with other practitioners and the research community. Hence, the track strongly focuses on real-word experiences made by practitioners. Topics of interest include but are not limited to:
- Problems caused by Technical Debt.
- Approaches that helped to deal with Technical Debt.
- Approaches that failed at dealing with Technical Debt.
- Experiences with tools that help to deal with Technical Debt.
To ensure the relevance of presented topics, we explicitly discourage the submission of approaches, methods or tools that have not been applied in real-world situations for a sufficiently long time. However, we do encourage the submission of failure reports as these are of high value for practitioners and researchers.
Please submit an abstract of your presentation with at least 300 words. Presenters are expected to give in-person presentations at the conference in Lisbon, Portugal. Presentation time will depend on the number of accepted submissions but is expected to be 20 to 30 minutes.
How to submit: Please use this form to submit your contribution.
Relevance of the submissions will be evaluated by the track chairs in a short video call with the presenters. The following evaluation criteria will be considered:
- The relevance of the topic to the conference.
- The speaker’s expertise on the topic.
- The potential for the presentation to stimulate discussion and debate and/or to generate new and innovative ideas.
- Submission deadline: January 31, 2024
- Interviews (short video call with track chairs): February 19-23, 2024
- Notification: February 29, 2024
- At TechDebt you meet other practitioners that have to deal with Technical Debt every day.
- At TechDebt you meet researchers that present new and innovative approaches to tackle Technical Debt.
- TechDebt’s in-person format allows for an actual exchange of experiences and ideas. between academia, industry and non-commercial organizations.
- TechDebt will be in Lisbon and easily reachable from all major European and International airports.
- 2-for-1: TechDebt is co-located with the International Conference on Software Engineering (ICSE), the premier gathering of Software Engineering researchers. ICSE also features many other co-located conferences and workshops. Therefore, traveling to TechDebt means one trip, but two premier events in a week.