TechDebt 2024
Sun 14 - Mon 15 April 2024 Lisbon, Portugal
co-located with ICSE 2024

Technical Debt is one of the most important metaphors in software evolution. It expresses development shortcuts, taken for expediency but causing the degradation of internal software quality. One of the key aspects of the technical debt metaphor is its nature towards closing the communication gap between technical and non-technical stakeholders in software development teams. The International Conference on Technical Debt (TechDebt) is the premier conference for managing technical debt in software projects. TechDebt brings together leading software engineering researchers and practitioners to discuss approaches for managing several types of Technical Debt, to share experiences and best practices, and to identify key challenges in industry and academia.

The 7th International Conference on Technical Debt will be held in April 2024 in Lisbon, Portugal. As in previous editions, TechDebt will be co-located with the 46th International Conference on Software Engineering (ICSE 2024).

Dates
Tracks
You're viewing the program in a time zone which is different from your device's time zone change time zone

Sun 14 Apr

Displayed time zone: Lisbon change

09:00 - 10:30
Opening sessionPlenary at Vianna da Motta
Chair(s): Zadia Codabux University of Saskatchewan, Canada, Matthias Galster University of Canterbury, Rodrigo Spinola Virginia Commonwealth University

Voting for all presentations (except keynotes and invited talks): https://docs.google.com/forms/d/e/1FAIpQLSes4USLU1cav7r3gXoEkbAoCOQ9S2clhuXoAIBmkF3D1_U6aQ/viewform

09:00
15m
Day opening
Conference opening
Plenary
P: Zadia Codabux University of Saskatchewan, Canada, P: Rodrigo Spinola Virginia Commonwealth University, G: Matthias Galster University of Canterbury
09:15
60m
Keynote
Keynote 1: Technical Debt: Are we human or are we dancer(s)?
Plenary
K: Alexander Chatzigeorgiou University of Macedonia
10:15
15m
Keynote
Keynote Q&A
Plenary
S: Zadia Codabux University of Saskatchewan, Canada, S: Rodrigo Spinola Virginia Commonwealth University
11:00 - 12:30
Technical papersIndustry track / Technical papers at Vianna da Motta
Chair(s): Vladimir Mandić Faculty of Technical Sciences, University of Novi Sad
11:00
20m
Research paper
What you See is What you Get: Exploring the Relation between Code Aesthetics and TD Interest
Technical papers
Theodoros Maikantis University of Macedonia, Iliana Natsiou University of Macedonia, Apostolos Ampatzoglou University of Macedonia, Alexander Chatzigeorgiou University of Macedonia, Stelios Xinogalos , Nikolaos Mittas International Hellenic University
11:20
5m
Live Q&A
Q&A
Technical papers

11:25
20m
Research paper
Exploring Process Debt in Large-Scale Agile Software Development For Secure Telecom Solutions
Technical papers
Hina Saeeda , Muhammad Ovais Ahmad Karlstad University, Tomas Gustavsson Karlstad University
11:45
5m
Live Q&A
Q&A
Industry track

11:50
20m
Research paper
Increasing, not Diminishing: Investigating the Returns of Highly Maintainable Code
Technical papers
Markus Borg CodeScene, Ilyana Pruvost , Enys Mones CodeScene, Adam Tornhill Codescene AB
Pre-print
12:10
5m
Live Q&A
Q&A
Industry track

12:15
10m
Research paper
Different Debt: An Addition to the Technical Debt Dataset and a Demonstration Using Developer Personality
Technical papers
Lorenz Graf-Vlachy University of Stuttgart, Stefan Wagner Technical University of Munich
Pre-print
12:25
5m
Live Q&A
Q&A
Technical papers

14:00 - 15:30
ERF/industryIndustry track / Emerging Researchers' Forum at Vianna da Motta
Chair(s): Florian Deissenboeck CQSE GmbH, Tushar Sharma Dalhousie University
14:00
5m
ERF introduction
Emerging Researchers' Forum
S: Tushar Sharma Dalhousie University
14:05
15m
Research paper
Towards a Technical Debt for Recommender System
Emerging Researchers' Forum
Sergio Moreschini Tampere University, Valentina Lenarduzzi University of Oulu, Ludovik Coba Roku Inc
14:20
10m
Live Q&A
Q&A
Emerging Researchers' Forum
S: Tushar Sharma Dalhousie University
14:30
25m
Panel
Panel
Emerging Researchers' Forum
S: Tushar Sharma Dalhousie University, P: Nicolás E. Díaz Ferreyra Hamburg University of Technology, P: Thomas Durieux TU Delft, P: Alexander Chatzigeorgiou University of Macedonia
14:55
5m
Industry talk
Industry track introduction
Industry track
15:00
20m
Industry talk
AI-based consolidation of text modules
Industry track
P: Robert Weidinger Versicherungskammer Bayern
15:20
10m
Live Q&A
Q&A
Industry track

16:00 - 17:30
Industry sessionIndustry track at Vianna da Motta
Chair(s): Florian Deissenboeck CQSE GmbH
16:00
20m
Industry talk
OutSystems AI Mentor System - Technical Debt Dashboard
Industry track
P: Alexandre Lemos OutSystems, P: Joana Coutinho
16:20
10m
Live Q&A
Q&A
Industry track

16:30
20m
Industry talk
Don't Fight but Embrace TechDebts
Industry track
P: Dirk Kröhan QAware GmbH
16:50
10m
Live Q&A
Q&A
Industry track

17:00
20m
Industry talk
The Hidden Cost: Technical Debt and Its Ambiguous Influence on UX
Industry track
Veronika Dashuber QAware GmbH
17:20
10m
Live Q&A
Q&A
Industry track

18:30 - 21:00
18:30
2h30m
Social Event
Conference dinner at Restaurante Guelra
Technical papers

Mon 15 Apr

Displayed time zone: Lisbon change

09:00 - 10:30
Technical papers and networkingPlenary / Technical papers at Vianna da Motta
Chair(s): Marek Stochel Motorola Solutions
09:00
10m
Research paper
Debt Stories: Capturing Social and Technical Debt in the Industry
Technical papers
Nicolas Riquet University of Namur, Xavier Devroey University of Namur, Benoît Vanderose University of Namur
DOI Pre-print
09:10
5m
Live Q&A
Q&A
Technical papers

09:15
5m
Research paper
Comparing Multivariate Time Series Analysis and Machine Learning Performance for Technical Debt Prediction: The SQALE Index Case
Technical papers
Mikel Robredo University of Oulu, Nyyti Saarimäki Tampere University, Rafael Peñaloza , Davide Taibi University of Oulu and Tampere University , Valentina Lenarduzzi University of Oulu
09:20
5m
Live Q&A
Q&A
Technical papers

09:25
5m
Talk
A Design of an Empirical Survey to Investigate Technical Debt in Blockchain Based Projects (talk and poster only)
Technical papers
P: Andrej Katin , P: Nebojša Taušan INFORA Research Group doo, P: Vladimir Mandić Faculty of Technical Sciences, University of Novi Sad, P: Miroslav Stefanović University of Novi Sad, P: Sonja Ristić University of Novi Sad
09:30
5m
Live Q&A
Q&A
Technical papers

09:35
20m
Talk
Technical Debt Management (invited talk)
Plenary
P: Paris Avgeriou University of Groningen, The Netherlands
09:55
5m
Live Q&A
Q&A (invited talk)
Plenary

10:00
30m
Poster
Posters and networking
Plenary
S: Tim Menzies North Carolina State University, S: Daniel Feitosa University of Groningen, P: Markus Borg CodeScene, P: Mikel Robredo University of Oulu, P: Nyyti Saarimäki Tampere University, P: Rafael Peñaloza , P: Davide Taibi University of Oulu and Tampere University , P: Valentina Lenarduzzi University of Oulu, P: Andrej Katin , P: Nebojša Taušan INFORA Research Group doo, P: Vladimir Mandić Faculty of Technical Sciences, University of Novi Sad, P: Miroslav Stefanović University of Novi Sad, P: Sonja Ristić University of Novi Sad, S: Joost Visser Leiden University
11:00 - 12:30
Keynote and closing sessionPlenary at Vianna da Motta
Chair(s): Zadia Codabux University of Saskatchewan, Canada, Rodrigo Spinola Virginia Commonwealth University
11:00
60m
Keynote
Keynote 2: Technical Debt in the Era of Artificial Intelligence: A TechDebt’s Offer AI Can’t Refuse
Plenary
K: Fabio Palomba University of Salerno
12:00
15m
Keynote
Keynote Q&A
Plenary
S: Zadia Codabux University of Saskatchewan, Canada, S: Rodrigo Spinola Virginia Commonwealth University
12:15
15m
Day closing
Awards and conference closing
Plenary
P: Zadia Codabux University of Saskatchewan, Canada, P: Rodrigo Spinola Virginia Commonwealth University, G: Matthias Galster University of Canterbury

Unscheduled Events

Not scheduled
Live Q&A
Q&A
Technical papers

Not scheduled
Live Q&A
Q&A
Technical papers

Call for Papers

Motivation

Technical Debt is one of the most important metaphors in software evolution. It expresses development shortcuts, taken for expediency but causing the degradation of internal software quality. One of the key aspects of the technical debt metaphor is its nature towards closing the communication gap between technical and non-technical stakeholders in software development teams. The International Conference on Technical Debt (TechDebt) is the premier conference for managing technical debt in software projects. TechDebt brings together leading software engineering researchers and practitioners to discuss approaches for managing several types of Technical Debt, to share experiences and best practices, and to identify key challenges in industry and academia.

The 7th International Conference on Technical Debt will be held in April 2024 in Lisbon, Portugal. As in previous editions, TechDebt will be co-located with the 46th International Conference on Software Engineering (ICSE 2024).

Topics

The TechDebt conference invites significant research contributions to the Technical Track. The topics of interest include, but are not limited to:

  • Quality assurance activities towards Technical Debt management
  • Use of artificial intelligence approaches to support Technical Debt Management
  • Human factors and Technical Debt
  • Interplay between Software Economics and Technical Debt
  • Software visualization for supporting Technical Debt identification and monitoring
  • Case studies on (un)successful debt management
  • Case studies on (un)successful remediation of Technical, Process, and Social Debt
  • Estimation of Principal and Interest of specific kinds of debt
  • Frameworks for the estimation of Principal and Interest
  • Stakeholders’ concerns on Technical, Process, and Social Debt
  • Measurement frameworks to study the components of Technical, Process, and Social Debt
  • Methods and tools for monitoring Technical, Process, and Social Debt
  • Empirical evidence on Technical, Process, and Social Debt management tools and their accuracy
  • Decision frameworks for prioritizing debt items among themselves and against features
  • Architectural Technical Debt
  • Less studied kinds of Technical Debt: e.g., Requirement, Test, Documentation, Infrastructure, Security Debt
  • Comparison and relationships between Technical, Process, and Social Debt and other topics (e.g., DevOps, Machine Learning, etc.)
  • Replication studies on Technical Debt

We invite submissions of papers to the Technical Track in any areas related to the theme and goal of the conference in the following categories:

  • Research Papers (up to 10 pages): innovative and significant original research in the field
  • Experience Papers (up to 10 pages): experience, case studies, challenges, problems, and solutions drawn from the application of technical debt tools and techniques in the industrial context.
  • Short Papers (up to 5 pages): early stages of research, including new ideas, visions, and/or reflections; or negative results; or innovative and original tools addressing technical debt issues or aiming at managing technical debt.

Evaluation criteria

Submissions must be original and unpublished work. Each paper submitted to the main Technical Track will undergo a rigorous review process by at least three members of the program committee.

  • Relevance: Submission must respond to the Call for Papers.
  • Novelty: Is there sufficient originality in the contribution, and is it clearly and correctly explained with respect to the state of the art? Novelty also includes additional evidence for a previously studied problem (e.g., in replications).
  • Soundness: Are all claimed contributions supported by the rigorous application of appropriate research methods? Claims should be scoped to what can be supported, and limitations should be discussed.
  • Significance: Are contributions evaluated for their importance and impact with respect to the existing body of knowledge? The authors are expected to explicitly argue for the claimed contributions through a comparison with pertinent related work.
  • Replicability: Is there sufficient information in the paper for the results to be independently replicated? The evaluation of submissions will take into account the extent to which sufficient information is available to support the full or partial independent replication of the claimed findings. Upon submission to the research track, authors are asked to make their data available (via upload of supplemental material or a link to an anonymous repository) and provide instructions on how to access this data in the paper or to include an explanation as to why this is not possible or desirable; and to indicate if they intend to make their data publicly available upon acceptance.
  • Presentation Quality: Are results clearly presented? Submissions are expected to meet high standards of presentation, including adequate use of the English language, absence of major ambiguity, clearly readable figures and tables, and respect for the formatting instructions.

The weighting and relevance of the above criteria vary for paper types.

Submission process

TechDebt 2024 is using a doubly anonymous reviewing model for the Technical Track. Therefore, all submissions to this track have to fulfill the doubly-anonymous reviewing requirements (refer to the ICSE Q&A for more details). Any submission that does not comply with these requirements may be desk-rejected without further review.

Papers must be submitted electronically via the TechDebtConf2024 HotCRP site (https://techdebt2024.hotcrp.com/). The paper format of TechDebt2024 must follow the ACM formatting guidelines, see also http://www.acm.org/publications/proceedings-template for both Latex and Word users. LaTEX users must use the provided acmart.cls and ACM-Reference-Format.bst without modification, enable the conference format in the preamble of the document (i.e., \documentclass[sigconf,review,anonymous]{acmart}), and use the ACM reference format for the bibliography (i.e., \bibliographystyle{ACM-Reference-Format}). To that end, the following LaTeX code can be placed at the start of the LaTeX document: \documentclass[sigconf,review,anonymous]{acmart} and \acmConference[TechDebt 2024]{7th International Conference on Technical Debt}{April 14--15, 2024}{Lisbon, Portugal}.

Submissions may not exceed the number of pages specified above (including all text, references, and figures). The purchase of additional pages in the proceedings is not allowed.

Open Science policy

Openness in science is key to fostering progress via transparency, reproducibility, and replicability. While all submissions will undergo the same review process independent of whether or not they disclose their analysis code or data, we strongly encourage authors to make data available upon submission (either privately or publicly) and especially upon acceptance (publicly). If the authors cannot disclose industrial or otherwise non-public data, they should provide an explicit (short) statement in the paper.

Accepted papers and attendance expectations

The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of ICSE 2024. The official publication date affects the deadline for any patent filings related to published work.

After acceptance, the list of paper authors cannot be changed under any circumstances, and the list of authors on camera-ready papers must be identical to those on submitted papers. After acceptance, paper titles can not be changed except by permission of the Program Co-Chairs, and only then when referees recommend a change for clarity or accuracy with paper content.

If a submission is accepted, at least one author of the paper is required to register for TechDebt 2024 and present the paper.

Important dates

  • Abstract deadline: November 14, 2023
  • Paper deadline: November 17, 2023 November 24, 2023
  • Author notification: January 10, 2024
  • Camera ready deadline: January 28, 2024