TechDebt 2025
Sun 27 - Mon 28 April 2025 Ottawa, Ontario, Canada
co-located with ICSE 2025

Technical Debt stands as a pivotal metaphor in the realm of software evolution, representing development shortcuts taken for expediency that cause the degradation of internal software quality. A critical element of the technical debt metaphor is its ability to bridge the communication gap between technical and non-technical stakeholders within software development teams. The International Conference on Technical Debt (TechDebt) is the flagship conference dedicated to discuss how to identify, address, and manage technical debt in software projects. This premier event unites leading researchers and practitioners in software engineering to explore diverse strategies for managing various forms of technical debt, share experiences and best practices, and identify the most pressing challenges faced by both industry and academia.

The 8th International Conference on Technical Debt will be held in April 2025 in Ottawa, Ontario, Canada. As the previous editions, TechDebt will be co-located with the 47th International Conference on Software Engineering (ICSE 2025).

Dates
Sun 27 Apr 2025
Mon 28 Apr 2025
Plenary
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Sun 27 Apr

Displayed time zone: Eastern Time (US & Canada) change

07:00 - 19:00
Ready Room SundayICSE Social, Networking and Special Rooms at 209

The Ready Room will be available throughout the week. There will be some tables with computers where people can edit presentations (bring on a USB stick) and upload presentations to the presentation rooms through the Contact 1 website. There will also be AV technicians to help if needed.

You do not need to use the Ready Room: You have several choices: You can upload your presentation from your own computer in advance of your session (days in advance even) at the Contact 1 website (you will be sent a link). Or you can plug your computer in using an HDMI cable when you are starting your presentation. This last option is available but not recommended, since it increases the chance of delays.

There will be some tables and couches in the Ready Room where you can get work done, or have small get-togethers with people.

This room will not be ‘quiet’. If you want a quiet place to work or chill out (library quiet, no talking) then Room 209 will be available much of the time.

The Ready Room will also have some poster boards.

09:00 - 12:30
Child Care Sunday AMICSE Social, Networking and Special Rooms at 102 Child Care

Child Care at ICSE is free, but you must have registered for child care when you registered for the conference.

If you need to add child care to your registration, please contact the registration desk.

09:00 - 10:30
KeynoteTechnical Papers at 103
Chair(s): Maria Teresa Baldassarre Department of Computer Science, University of Bari
09:00
90m
Talk
Towards an Interpretable Science of Deep Learning for Engineering Quality Software: A Causal Inference View
Technical Papers
Denys Poshyvanyk William & Mary
10:30 - 11:00
10:30
30m
Coffee break
Sunday Morning Break
ICSE Catering

11:00 - 12:30
Research PapersTechnical Papers at 103
Chair(s): Daniel Feitosa University of Groningen
11:00
30m
Research paper
Aligning Data Debt with AI-Integrated Software Project Lifecycle Processes: A Standard-Based Mapping Approach
Technical Papers
Nilay Yorgancılar Akgül HAVELSAN, Middle East Technical University, Tugba Taskaya Temizel Middle East Technical University, Özden Özcan Top Middle East Technical University, Pelin Dayan Akman Middle East Technical University
11:30
30m
Research paper
Automating Technical Debt Management: Insights from Practitioner Discussions in Stack Exchange
Technical Papers
João Paulo Biazotto University of Groningen and University of São Paulo, Daniel Feitosa University of Groningen, Paris Avgeriou Univ. of Gronningen , Elisa Yumi Nakagawa University of São Paulo
Pre-print
12:00
10m
Paper
Experiences with Technical Debt and its Root Causes in a Merged Industrial Company
Technical Papers
Magnus Drewsen Jørgensen , Nina Wiborg Mølgaard Mjølner Informatics, Morten Jokumsen Mjølner Informatics, Jens Bæk Jørgensen Mjølner Informatics, Henrik Bærbak Christensen
File Attached
12:10
10m
Product announcement
ACE: Automated Technical Debt Remediation with Validated Large Language Model Refactorings
Technical Papers
Adam Tornhill Empear AB, Markus Borg CodeScene
12:20
10m
Talk
Lighting Talk: Evidence is All We Need: Do Self-Admitted Technical Debts Impact Method-Level Maintenance?
Technical Papers
Shaiful Chowdhury University of Manitoba, Hisham Kidwai University of Manitoba, Muhammad Asaduzzaman University of Windsor
12:30 - 14:00
12:30
90m
Lunch
Sunday Lunch
ICSE Catering

14:00 - 15:30
Research Papers and PostersIndustry Track / Technical Papers at 103
Chair(s): Fatemeh Hendijani Fard Department of Computer Science, Mathematics, Physics and Statistics, University of British Columbia, Okanagan Campus, Reed Milewicz Sandia National Laboratories
14:00
30m
Paper
The TechDebt Game - Enabling Discussions about Technical Debt
Technical Papers
Marion Wiese University of Hamburg, Germany, Angelina Heinrichs University of Hamburg, Nino Rusieshvilli University of Hamburg, Rodrigo Rebouças de Almeida Federal University of Paraiba, Klara Borowa Warsaw University of Technology
DOI Pre-print
14:30
10m
Industry talk
Perspective-Taking as a Strategy to Manage Technical Debt
Industry Track
Kezia Devathasan University of Victoria, Mike Rowling Felix Payment Systems
14:40
10m
Industry talk
A Quantitative Approach to Measuring Technical Debt: The Technical Debt Index (TDI)
Industry Track
Nitin Gupta Assembly Digital and the University of Victoria
14:50
10m
Industry talk
Automating Dead Code Cleanup: Challenges Beyond the Code
Industry Track
15:00
10m
Industry talk
Addressing Technical Debt through Collaboration
Industry Track
15:10
20m
Panel
War Stories in TechDebt
Industry Track
Reed Milewicz Sandia National Laboratories, Fatemeh Hendijani Fard Department of Computer Science, Mathematics, Physics and Statistics, University of British Columbia, Okanagan Campus
15:30 - 16:00
15:30
30m
Break
Sunday Afternoon Break
ICSE Catering

Mon 28 Apr

Displayed time zone: Eastern Time (US & Canada) change

07:00 - 19:00
Ready Room MondayICSE Social, Networking and Special Rooms at 209

The Ready Room will be available throughout the week. There will be some tables with computers where people can edit presentations (bring on a USB stick) and upload presentations to the presentation rooms through the Contact 1 website. There will also be AV technicians to help if needed.

You do not need to use the Ready Room: You have several choices: You can upload your presentation from your own computer in advance of your session (days in advance even) at the Contact 1 website (you will be sent a link). Or you can plug your computer in using an HDMI cable when you are starting your presentation. This last option is available but not recommended, since it increases the chance of delays.

There will be some tables and couches in the Ready Room where you can get work done, or have small get-togethers with people.

This room will not be ‘quiet’. If you want a quiet place to work or chill out (library quiet, no talking) then Room 209 will be available much of the time.

The Ready Room will also have some poster boards.

09:00 - 10:30
KeynoteTechnical Papers at 103
Chair(s): Roberto Verdecchia University of Florence
09:00
90m
Talk
Leveraging Research to Inform Structural Technical Debt Management
Technical Papers
Ciera Jaspan Google, Collin Green Google
09:00 - 10:30
10:30 - 11:00
10:30
30m
Break
Monday Morning Break
ICSE Catering

11:00 - 12:30
Research papers and MIPTechnical Papers at 103
11:00
30m
Research paper
Most Influential Paper: Detecting and Quantifying Different Types of Self-Admitted Technical Debt
Technical Papers
Everton Maldonado Concordia University, Montreal, Canada, Emad Shihab Concordia University, Montreal
11:30
30m
Research paper
Exploring Fairness Debt Through Evidence from Studies on Algorithmic Discrimination
Technical Papers
Fardin Aryan University of Calgary, Lucas Valença University of Calgary, Ronnie de Souza Santos University of Calgary
File Attached
12:00
30m
Research paper
Requirements Technical Debt Through the Lens of Environment Assumptions
Technical Papers
Mounifah Alenazi University of Hafr Al Batin
11:00 - 12:30
12:30 - 14:00
12:30
90m
Lunch
Monday Lunch
ICSE Catering

14:00 - 15:30
Talks, Discussions, and ClosingTechnical Papers at 103
Chair(s): Rodrigo Spinola Virginia Commonwealth University
14:00
10m
Talk
Lighting Talk: Leveraging Context Information for Self-Admitted Technical Debt Detection
Technical Papers
Miki Yonekura Nara Institute of Science and Technology, Yutaro Kashiwa Nara Institute of Science and Technology, Bin Lin Hangzhou Dianzi University, Kenji Fujiwara Nara Women’s University, Hajimu Iida Nara Institute of Science and Technology
14:10
20m
Talk
Discussion: Reframing Technical Debt - Insights from the Dagstuhl Perspectives Workshop
Technical Papers
P: Neil Ernst University of Victoria, P: Zadia Codabux University of Saskatchewan
14:30
50m
Town Hall
Technical Papers
M: Carolyn Seaman University of Maryland Baltimore County
15:20
10m
Day closing
Awards & Closing & TechDebt 2026
Technical Papers

14:00 - 15:30
15:30 - 16:00
15:30
30m
Break
Monday Afternoon Break
ICSE Catering

16:00 - 17:30

Unscheduled Events

Not scheduled
Day closing
TechDebt 2026
Technical Papers
Rodrigo Spinola Virginia Commonwealth University

Call for Papers

Motivation

Technical Debt stands as a pivotal metaphor in the realm of software evolution, representing development shortcuts taken for expediency that cause the degradation of internal software quality. A critical element of the technical debt metaphor is its ability to bridge the communication gap between technical and non-technical stakeholders within software development teams. The International Conference on Technical Debt (TechDebt) is the flagship conference dedicated to discuss how to identify, address, and manage technical debt in software projects. This premier event unites leading researchers and practitioners in software engineering to explore diverse strategies for managing various forms of technical debt, share experiences and best practices, and identify the most pressing challenges faced by both industry and academia.

The 8th International Conference on Technical Debt will be held in April 2025 in Ottawa, Ontario, Canada. As the previous editions, TechDebt will be co-located with the 47th International Conference on Software Engineering (ICSE 2025).

Topics

The TechDebt conference warmly invites research and practical contributions to its Technical Track. The topics of interest include, but are not limited to:

Investigations on Specific Technical Debt Types

  • Specific technical debt types (e.g., test debt, build debt, architectural debt)
  • Less studied kinds of technical debt (e.g., requirement, documentation, security debt)
  • Other types of debt (e.g., social debt, process debt)
  • Debt in specific domains (e.g., AI-based systems, mobile applications)

Case Studies and Practical Experiences

  • Case studies on successful and unsuccessful technical debt management practices
  • Case studies on the remediation of technical debt in real-world projects
  • Experiences from industry on managing and paying down technical debt
  • Empirical evidence on the effectiveness of technical debt management tools and approaches

Tools and Approaches for Managing Technical Debt

  • Tools, demos, and libraries to identify, assess, and manage technical debt
  • Methods and frameworks for identifying, monitoring, and managing technical debt
  • Decision frameworks for prioritizing debt items against features and other debts
  • Estimation of technical debt principal and interest
  • Quality assurance practices to minimize and address technical debt

Human and Organizational Factors

  • Human factors in managing technical debt (e.g., team dynamics, communication challenges)
  • Stakeholder perspectives and concerns about technical debt
  • The impact of organizational culture and processes on technical debt accumulation and repayment

Emerging Trends in Technical Debt Research

  • Use of artificial intelligence and machine learning for technical debt management
  • Software visualization techniques for technical debt identification and monitoring
  • New trends in technical debt for AI-driven systems and mobile applications
  • The role of software economics in shaping technical debt decisions

Position and Vision Papers

  • Position and vision papers offering novel perspectives on technical debt
  • New conceptual frameworks and metrics to study technical debt and its evolution

Paper categories

We invite submissions of papers to the Technical Track in any areas related to the theme and goal of the conference in the following categories:

  • Research Papers (up to 10 pages, plus 2 pages for references only): Innovative and significant original research in the field
  • Experience Papers (up to 10 pages, plus 2 pages for references only): Experiences, case studies, challenges, problems, and solutions gathered from industrial contexts.
  • Short Papers (up to 5 pages, plus 2 pages for references only): Early stages of research, new ideas, visions, and/or reflections; or technical debt-related tools.

All submissions must not exceed their page limit for the main text, inclusive of all figures, tables, appendices, etc. Two more pages containing only references are permitted. All submissions must be in PDF.

Upon acceptance, papers will be included in the 8th International Conference on Technical Debt proceedings.

Evaluation criteria

Submissions must be original and unpublished work. Each paper submitted to the main Technical Track will undergo a rigorous review process by at least three members of the program committee.

  1. Novelty: The novelty and innovativeness of contributed solutions, problem formulations, methodologies, theories, and/or evaluations, i.e., the extent to which the paper is sufficiently original with respect to the state-of-the-art.
  2. Rigor: The soundness, clarity, and depth of a technical or theoretical contribution, and the level of thoroughness and completeness of an evaluation.
  3. Relevance: The significance and/or potential impact of the research on the field of software engineering.
  4. Verifiability and Transparency: The extent to which the paper includes sufficient information to understand how an innovation works; to understand how data was obtained, analyzed, and interpreted; and how the paper supports independent verification or replication of the paper’s claimed contributions. Any artifacts attached to or linked from the paper will be checked by one reviewer.
  5. Presentation: The clarity of the exposition in the paper.

Reviewers will carefully consider all of the above criteria during the review process, and authors should take great care in clearly addressing them all. The paper should clearly explain and justify the claimed contributions. The weighting and relevance of the above criteria vary for paper types, e.g., a vision paper is primarily evaluated on novelty and relevance and not verifiability.

Junior PC

TechDebt 2025 proudly introduces a Junior Program Committee (Junior PC), which operates alongside the main program committee to enhance the review process and mentor the next generation of researchers. Composed of early-career scholars, the Junior PC reviews a subset of papers under the guidance of experienced mentors. The feedback they provide offers additional input to authors, enriching the TechDebt review process while ensuring high-quality reviews and supporting the growth of future leaders in the field of technical debt.

Submission process

TechDebt 2025 uses a doubly anonymous reviewing model for the Technical Track. Therefore, all submissions to this track have to fulfill the doubly-anonymous reviewing requirements (refer to the ICSE Q&A for more details). Any submission that does not comply with these requirements may be desk-rejected without further review.

Papers must be submitted electronically via the TechDebtConf2025 HotCRP site.

Submission site: https://techdebt2025.hotcrp.com.

Submissions must conform to the IEEE conference proceedings template, specified in the IEEE Conference Proceedings Formatting Guidelines (title in 24pt font and full text in 10pt type, LaTeX users must use \documentclass[10pt,conference]{IEEEtran} without including the compsoc or compsocconf options).

Link: https://www.ieee.org/conferences/publishing/templates.html

Open Science policy

Openness in science is key to fostering progress via transparency, reproducibility, and replicability. While all submissions will undergo the same review process independent of whether or not they disclose their analysis code or data, we strongly encourage authors to make data available upon submission (either privately or publicly) and especially upon acceptance (publicly). If the authors cannot disclose industrial or otherwise non-public data, they should provide an explicit (short) statement in the paper.

Accepted papers and attendance expectations

After acceptance, the list of paper authors cannot be changed under any circumstances, and the list of authors on camera-ready papers must be identical to those on submitted papers. After acceptance, paper titles can not be changed except by permission of the Program Co-Chairs, and only then when referees recommend a change for clarity or accuracy with paper content.

If a submission is accepted, at least one author of the paper is required to register for TechDebt 2025 and present the paper.

Important dates

  • Abstract deadline: Nov 8, 2024
  • Paper deadline: Nov 15, 2024
  • Author notification: Jan 10, 2025
  • Camera ready deadline: Jan 31, 2025

Mentoring Program

Authors can make use of the Mentoring Program to offer mentorship to help bring new researchers to the community and assist those who would like to improve their papers by getting independent advice to ensure that papers are consistent with the existing technical debt body of work, focus on critical open challenges, and are accessible to everyone. Check out the Mentoring Program here.

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