Automatically Deciding on the Integration of Commits Based on Their Descriptions
Continuous Integration is a critical problem for software maintenance in global projects compromising companies’ performance, which tends to accumulate a high-resolution time due to the approval process, conflict resolution, tests, and validations. The process of the validation involves the commit description interpretation and can be automated by NLP-mechanisms. This paper presents an intelligent NLP-based approach to evaluate if the commits can integrate a software release based only on their descriptions, including paraphrasing. The solution is validated using pre-classified commits on the training stage and achieved an accuracy of 92.9%. The proposed solution allows the automatic integration of the commits in a release with confidence, mitigating the software managing efforts.
Wed 17 NovDisplayed time zone: Hobart change
09:00 - 10:00 | Analysis IJournal-first Papers / Research Papers / Industry Showcase at Koala Chair(s): Pavneet Singh Kochhar Microsoft | ||
09:00 20mTalk | Faster Mutation Analysis with Fewer Processes and Smaller Overheads Research Papers Bo Wang Beijing Jiaotong University, Sirui Lu Peking University, Yingfei Xiong Peking University, Feng Liu Beijing Jiaotong University | ||
09:20 20mTalk | FRUGAL: Unlocking Semi-supervised Learning for Software Analytics Research Papers | ||
09:40 10mTalk | Automatically Deciding on the Integration of Commits Based on Their Descriptions Industry Showcase Samuel Cristo da Fonseca Sidia R&D, Mateus C. Lucena Sidia R&D , Tiago M. Reis Sidia R&D, Pedro F. Cabral Sidia R&D, Walmir A. Silva Sidia R&D, Flavia de S. Santos Sidia R&D, Felipe T. Giuntini Sidia R&D, Juliano Sales Sidia R&D | ||
09:50 10mTalk | SigRec: Automatic Recovery of Function Signatures in Smart Contracts Journal-first Papers Ting Chen University of Electronic Science and Technology of China, Zihao Li The Hong Kong Polytechnic Universituy, Xiapu Luo Hong Kong Polytechnic University, XiaoFeng Wang Indiana University Bloomington, Ting Wang Penn State University, Hongwei Li University of Electronic Science and Technology of China, Xiaosong Zhang University of Electronic Science and Technology of China Link to publication DOI |