ECOOP and ISSTA 2021 (series) / Cong Pan
Registered user since Mon 17 Feb 2020
Name:Cong Pan
Bio:
4th year of Ph. D study in Beihang University.
Country:China
Affiliation:Beihang University
Research interests:Software reliability, software engineering, software defect prediction, software failure prediction
Contributions
2021
ECOOP and ISSTA 2021-profile
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