The ACM SIGSOFT International Symposium on Software Testing and Analysis is the leading research symposium on software testing and analysis, bringing together academics, industrial researchers, and practitioners to exchange new ideas, problems, and experience on how to analyze and test software systems.
ISSTA 2019 will be held in Beijing, China, on July 15-19, 2019.
ISSTA 2019 will be co-located with SPIN 2019, Testing Competition and Diversity@ISSTA - Ada workshop.
ISSTA 2019 will be held in Crowne Plaza Beijing Zhongguancun. Zhongguancun is known as China’s Silicon Valley and China’s center of innovation and technology entrepreneurship. China’s two most prestigious universities, Peking University and Tsinghua University, along with the Chinese Academy of Sciences, are located in Zhongguancun. There are also numerous IT companies and Internet firms in that area.
Beijing is a world-famous historic and cultural city and the political, economic, transportation and cultural center of the whole country. It has gathered the splendid culture and art of China, leaving many places of interest and cultural landscapes. It is also an innovative and modern city with rapidly developing high-tech industry.
All tracks of ISSTA 2019 are calling for submissions:
Mark your calendars and plan to join us for a memorable ISSTA 2019 in Beijing, China: July 15 - July 19 2019!
We are happy to announce that the paper HAMPI: a solver for string constraints by Adam Kiezun, Vijay Ganesh, Philip J. Guo, Pieter Hooimeijer, Michael D. Ernst, published in the ISSTA 2009 proceedings, has been selected to receive the ISSTA 2019 Impact Paper Award.
We are happy to announce that the paper Effective typestate verification in the presence of aliasing by Stephen Fink, Eran Yahav, Nurit Dor, G. Ramalingam, Emmanuel Geay, published in the ISSTA 2006 proceedings, has been selected to receive the ISSTA 2019 Retrospective Impact Paper Award.